Advanced Thermal Solutions Inc. - ATS-59009-C1-R0

KEY Part #: K6263915

ATS-59009-C1-R0 Preț (USD) [4005buc Stoc]

  • 1 pcs$9.17334
  • 10 pcs$8.66278
  • 25 pcs$7.75561
  • 50 pcs$7.27084
  • 100 pcs$6.78612
  • 250 pcs$6.30138
  • 500 pcs$6.18020

Numărul piesei:
ATS-59009-C1-R0
Producător:
Advanced Thermal Solutions Inc.
Descriere detaliata:
HEAT SINK 62MM X 52MM X 13MM. Heat Sinks maxiGRIP Heatsink Assembly, Double-Sided Adhesive, Black-Anodized, T412, 42.5mm Comp, 62x52x13mm
Timpul de livrare standard al producătorului:
In stoc
Termen de valabilitate:
Un an
Chip From:
Hong Kong
RoHS:
Modalitate de plată:
Mod de expediere:
Categorii de familii:
KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Răcire termică - lichid, Termopari, foi, DC Fanii, Tevi termice - căldură, camere de vapori, Ventilatoare - gardieri pentru degete, filtre & am, Adezivi termici, epoxizi, unsori, paste, Chiuvete termice and Module termoelectrice, Peltier ...
Avantaj competitiv:
We specialize in Advanced Thermal Solutions Inc. ATS-59009-C1-R0 electronic components. ATS-59009-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-59009-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-59009-C1-R0 Atributele produsului

Numărul piesei : ATS-59009-C1-R0
Producător : Advanced Thermal Solutions Inc.
Descriere : HEAT SINK 62MM X 52MM X 13MM
Serie : maxiGRIP
Starea parțială : Active
Tip : Top Mount
Pachetul răcit : Flip Chip Processors
Metoda de atașament : Clip
Formă : Rectangular, Fins
Lungime : 2.441" (62.00mm)
Lăţime : 2.047" (52.00mm)
Diametru : -
Înălțime în afara baza (înălțimea finului) : 0.512" (13.00mm)
Distrugerea puterii @ Creșterea temperaturii : -
Rezistența termică @ Air Forced Flow : 3.20°C/W @ 200 LFM
Rezistența termică @ Natural : -
Material : Aluminum
Finisare material : Black Anodized

Poți fi, de asemenea, interesat
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3N-50.8-12.7-0.07-1A

    t-Global Technology

    PH3N NANO 50.8X12.07X0.07MM.