t-Global Technology - TI900-24-21.01-0.12

KEY Part #: K6153036

TI900-24-21.01-0.12 Preț (USD) [334003buc Stoc]

  • 1 pcs$0.11074
  • 10 pcs$0.10678
  • 25 pcs$0.10156
  • 50 pcs$0.09895
  • 100 pcs$0.09757
  • 250 pcs$0.09090
  • 500 pcs$0.08555
  • 1,000 pcs$0.07753
  • 5,000 pcs$0.07486

Numărul piesei:
TI900-24-21.01-0.12
Producător:
t-Global Technology
Descriere detaliata:
THERM PAD 24MMX21.01MM WHITE.
Timpul de livrare standard al producătorului:
In stoc
Termen de valabilitate:
Un an
Chip From:
Hong Kong
RoHS:
Modalitate de plată:
Mod de expediere:
Categorii de familii:
KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Ventilatoare - gardieri pentru degete, filtre & am, Răcire termică - lichid, Termice - Accesorii, Termopari, foi, Adezivi termici, epoxizi, unsori, paste, Ventilatoare - Accesorii - Cabluri ventilatoare, AC Fanii and Chiuvete termice ...
Avantaj competitiv:
We specialize in t-Global Technology TI900-24-21.01-0.12 electronic components. TI900-24-21.01-0.12 can be shipped within 24 hours after order. If you have any demands for TI900-24-21.01-0.12, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

TI900-24-21.01-0.12 Atributele produsului

Numărul piesei : TI900-24-21.01-0.12
Producător : t-Global Technology
Descriere : THERM PAD 24MMX21.01MM WHITE
Serie : Ti900
Starea parțială : Active
folosire : -
Tip : Conductive Insulator Pad
Formă : Rectangular
Contur : 24.00mm x 21.01mm
Grosime : 0.0050" (0.127mm)
Material : Silicone
Adeziv : -
Înapoi, Carrier : Viscose
Culoare : White
Rezistența termică : -
Conductivitate termică : 1.8 W/m-K

Poți fi, de asemenea, interesat
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-34

    Wakefield-Vette

    THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole