THINC23-21.5-11.4-5.8-0.8 Preț (USD) [132184buc Stoc]
- 1 pcs$0.28122
- 4 pcs$0.27982
- Numărul piesei:
- THINC23-21.5-11.4-5.8-0.8
- Producător:
- t-Global Technology
- Descriere detaliata:
- THERM PAD 21.5X11.4MMX5.8MM GRAY.
- Timpul de livrare standard al producătorului:
- In stoc
- Termen de valabilitate:
- Un an
- Chip From:
- Hong Kong
- RoHS:
- Modalitate de plată:
-
- Mod de expediere:
- Categorii de familii:
- KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Adezivi termici, epoxizi, unsori, paste, Ventilatoare - gardieri pentru degete, filtre & am, DC Fanii, Module termoelectrice, Peltier, Ventilatoare - Accesorii, Chiuvete termice, Tevi termice - căldură, camere de vapori and Răcire termică - lichid ...
- Avantaj competitiv:
- We specialize in t-Global Technology THINC23-21.5-11.4-5.8-0.8 electronic components. THINC23-21.5-11.4-5.8-0.8 can be shipped within 24 hours after order. If you have any demands for THINC23-21.5-11.4-5.8-0.8, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
THINC23-21.5-11.4-5.8-0.8 Atributele produsului
Numărul piesei :
THINC23-21.5-11.4-5.8-0.8
Producător :
t-Global Technology
Descriere :
THERM PAD 21.5X11.4MMX5.8MM GRAY
Serie :
THINC
Starea parțială :
Active
folosire :
-
Tip :
Interface Cap
Formă :
Rectangular
Contur :
21.50mm x 11.40mm x 5.80mm
Grosime :
0.0315" (0.800mm)
Material :
Silicone
Adeziv :
-
Înapoi, Carrier :
-
Culoare :
Gray
Rezistența termică :
-
Conductivitate termică :
1.9 W/m-K
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