PC93-24-21.01-3 Preț (USD) [83500buc Stoc]
- 1 pcs$0.46827
- 10 pcs$0.44611
- 25 pcs$0.43432
- 50 pcs$0.42262
- 100 pcs$0.39916
- 250 pcs$0.37569
- 500 pcs$0.33317
- 1,000 pcs$0.31096
- 5,000 pcs$0.29985
- Numărul piesei:
- PC93-24-21.01-3
- Producător:
- t-Global Technology
- Descriere detaliata:
- THERM PAD 24MMX21.01MM GRAY.
- Timpul de livrare standard al producătorului:
- In stoc
- Termen de valabilitate:
- Un an
- Chip From:
- Hong Kong
- RoHS:
- Modalitate de plată:
-
- Mod de expediere:
- Categorii de familii:
- KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Tevi termice - căldură, camere de vapori, Adezivi termici, epoxizi, unsori, paste, Ventilatoare - Accesorii, AC Fanii, DC Fanii, Ventilatoare - gardieri pentru degete, filtre & am, Ventilatoare - Accesorii - Cabluri ventilatoare and Module termoelectrice, Peltier ...
- Avantaj competitiv:
- We specialize in t-Global Technology PC93-24-21.01-3 electronic components. PC93-24-21.01-3 can be shipped within 24 hours after order. If you have any demands for PC93-24-21.01-3, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
PC93-24-21.01-3 Atributele produsului
Numărul piesei :
PC93-24-21.01-3
Producător :
t-Global Technology
Descriere :
THERM PAD 24MMX21.01MM GRAY
Serie :
PC93
Starea parțială :
Active
folosire :
-
Tip :
Conductive Pad, Sheet
Formă :
Rectangular
Contur :
24.00mm x 21.01mm
Grosime :
0.118" (3.00mm)
Material :
Non-Silicone
Adeziv :
-
Înapoi, Carrier :
-
Culoare :
Gray
Rezistența termică :
-
Conductivitate termică :
2.0 W/m-K
Cele mai recente știri
Poți fi, de asemenea, interesat
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Piese calde
- A15996-20
- A15996-11
- A14572-01
- A15996-06
- GPVOS-0.125-00-0816
- A14950-04
- T69-225-225-0.017-1A
- A14162-28
- A14162-42
- DC0039/05-PC99-0.06
- DC0040/08-PC99AL-0.1
- DC0040/07-PC99-0.06
- DC0036/02-PC99-0.06
- DC0038/04-PC99AL-0.1
- DC0038/07-PC99-0.06
- TG4040S-150-150-1.0-0
- TG2030S-150-150-1.0-0
- TG2030S-100-100-2.0-0
- PC94-300-300-0.25-0
- DC0022/01-PC99-0.12
- PC93-19.50-12.70-0.25
- PC93-150-150-0.25-0
- 400MM-1M-5515-20
- 19.05MM-5M-5515-20
- A15673-15
- A15673-08
- A16364-02
- A15641-15
- A15896-16
- A14162-33
- BOND PLY 660P 11X12"
- 5592 210 MM X 300 MM 1.0 MM
- 5591S 210 MM X 300 MM 0.5 MM
- TP01
- BP100-0.005-00-1010
- DC0037/02-PC99-0.06
- DC0041/03-PC99AL-0.1
- SPK4-0.006-AC-97
- SPK4-0.006-00-70
- Q3-0.005-00-105