[8725buc Stoc]
- Numărul piesei:
- APF19-19-13CB
- Producător:
- CTS Thermal Management Products
- Descriere detaliata:
- HEATSINK LOW-PROFILE FORGED.
- Timpul de livrare standard al producătorului:
- In stoc
- Termen de valabilitate:
- Un an
- Chip From:
- Hong Kong
- RoHS:
- Modalitate de plată:
-
- Mod de expediere:
- Categorii de familii:
- KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Module termoelectrice, Peltier, Ventilatoare - Accesorii, Adezivi termici, epoxizi, unsori, paste, Ventilatoare - Accesorii - Cabluri ventilatoare, Termice - Accesorii, Termoelectrice, ansambluri Peltier, Ventilatoare - gardieri pentru degete, filtre & am and Termopari, foi ...
- Avantaj competitiv:
- We specialize in CTS Thermal Management Products APF19-19-13CB electronic components. APF19-19-13CB can be shipped within 24 hours after order. If you have any demands for APF19-19-13CB, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
APF19-19-13CB Atributele produsului
Numărul piesei :
APF19-19-13CB
Producător :
CTS Thermal Management Products
Descriere :
HEATSINK LOW-PROFILE FORGED
Serie :
APF
Starea parțială :
Active
Tip :
Top Mount
Pachetul răcit :
Assorted (BGA, LGA, CPU, ASIC...)
Metoda de atașament :
Thermal Tape, Adhesive (Not Included)
Formă :
Square, Fins
Lungime :
0.748" (19.00mm)
Lăţime :
0.748" (19.00mm)
Diametru :
-
Înălțime în afara baza (înălțimea finului) :
0.500" (12.70mm)
Distrugerea puterii @ Creșterea temperaturii :
-
Rezistența termică @ Air Forced Flow :
4.00°C/W @ 200 LFM
Rezistența termică @ Natural :
-
Material :
Aluminum
Finisare material :
Black Anodized
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