BDN09-3CB/A01 Preț (USD) [35025buc Stoc]
- 1 pcs$0.98254
- 10 pcs$0.95745
- 25 pcs$0.93169
- 50 pcs$0.87993
- 100 pcs$0.82817
- 250 pcs$0.77641
- 500 pcs$0.75053
- 1,000 pcs$0.67289
- 5,000 pcs$0.65995
- Numărul piesei:
- BDN09-3CB/A01
- Producător:
- CTS Thermal Management Products
- Descriere detaliata:
- HEATSINK CPU W/ADHESIVE .91SQ.
- Timpul de livrare standard al producătorului:
- In stoc
- Termen de valabilitate:
- Un an
- Chip From:
- Hong Kong
- RoHS:
- Modalitate de plată:
-
- Mod de expediere:
- Categorii de familii:
- KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Termopari, foi, AC Fanii, DC Fanii, Termoelectrice, ansambluri Peltier, Răcire termică - lichid, Tevi termice - căldură, camere de vapori, Ventilatoare - gardieri pentru degete, filtre & am and Termice - Accesorii ...
- Avantaj competitiv:
- We specialize in CTS Thermal Management Products BDN09-3CB/A01 electronic components. BDN09-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN09-3CB/A01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
BDN09-3CB/A01 Atributele produsului
Numărul piesei :
BDN09-3CB/A01
Producător :
CTS Thermal Management Products
Descriere :
HEATSINK CPU W/ADHESIVE .91SQ
Serie :
BDN
Starea parțială :
Active
Tip :
Top Mount
Pachetul răcit :
Assorted (BGA, LGA, CPU, ASIC...)
Metoda de atașament :
Thermal Tape, Adhesive (Included)
Formă :
Square, Pin Fins
Lungime :
0.910" (23.11mm)
Lăţime :
0.910" (23.11mm)
Diametru :
-
Înălțime în afara baza (înălțimea finului) :
0.355" (9.02mm)
Distrugerea puterii @ Creșterea temperaturii :
-
Rezistența termică @ Air Forced Flow :
9.60°C/W @ 400 LFM
Rezistența termică @ Natural :
26.90°C/W
Material :
Aluminum
Finisare material :
Black Anodized
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