CTS Thermal Management Products - BDN11-3CB/A01

KEY Part #: K6265518

BDN11-3CB/A01 Preț (USD) [34131buc Stoc]

  • 1 pcs$1.24277
  • 10 pcs$1.21104
  • 25 pcs$1.17843
  • 50 pcs$1.05579
  • 100 pcs$0.99370
  • 250 pcs$0.93161
  • 500 pcs$0.90055
  • 1,000 pcs$0.80739
  • 5,000 pcs$0.79186

Numărul piesei:
BDN11-3CB/A01
Producător:
CTS Thermal Management Products
Descriere detaliata:
HEATSINK CPU W/ADHESIVE 1.11SQ.
Timpul de livrare standard al producătorului:
In stoc
Termen de valabilitate:
Un an
Chip From:
Hong Kong
RoHS:
Modalitate de plată:
Mod de expediere:
Categorii de familii:
KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Răcire termică - lichid, DC Fanii, Ventilatoare - Accesorii, Module termoelectrice, Peltier, Adezivi termici, epoxizi, unsori, paste, Termopari, foi, Termice - Accesorii and Termoelectrice, ansambluri Peltier ...
Avantaj competitiv:
We specialize in CTS Thermal Management Products BDN11-3CB/A01 electronic components. BDN11-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN11-3CB/A01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN11-3CB/A01 Atributele produsului

Numărul piesei : BDN11-3CB/A01
Producător : CTS Thermal Management Products
Descriere : HEATSINK CPU W/ADHESIVE 1.11SQ
Serie : BDN
Starea parțială : Active
Tip : Top Mount
Pachetul răcit : Assorted (BGA, LGA, CPU, ASIC...)
Metoda de atașament : Thermal Tape, Adhesive (Included)
Formă : Square, Pin Fins
Lungime : 1.110" (28.19mm)
Lăţime : 1.110" (28.19mm)
Diametru : -
Înălțime în afara baza (înălțimea finului) : 0.355" (9.02mm)
Distrugerea puterii @ Creșterea temperaturii : -
Rezistența termică @ Air Forced Flow : 7.20°C/W @ 400 LFM
Rezistența termică @ Natural : 20.90°C/W
Material : Aluminum
Finisare material : Black Anodized

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