DC0011/07-TI900-0.12-2A Preț (USD) [194835buc Stoc]
- 1 pcs$0.18984
- 10 pcs$0.18114
- 25 pcs$0.17196
- 50 pcs$0.16738
- 100 pcs$0.16516
- 250 pcs$0.15383
- 500 pcs$0.14478
- 1,000 pcs$0.13121
- 5,000 pcs$0.12669
- Numărul piesei:
- DC0011/07-TI900-0.12-2A
- Producător:
- t-Global Technology
- Descriere detaliata:
- THERM PAD 19.05MMX10.41MM W/ADH.
- Timpul de livrare standard al producătorului:
- In stoc
- Termen de valabilitate:
- Un an
- Chip From:
- Hong Kong
- RoHS:
- Modalitate de plată:
-
- Mod de expediere:
- Categorii de familii:
- KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Ventilatoare - Accesorii - Cabluri ventilatoare, Termice - Accesorii, Chiuvete termice, Tevi termice - căldură, camere de vapori, Termoelectrice, ansambluri Peltier, Ventilatoare - gardieri pentru degete, filtre & am, DC Fanii and AC Fanii ...
- Avantaj competitiv:
- We specialize in t-Global Technology DC0011/07-TI900-0.12-2A electronic components. DC0011/07-TI900-0.12-2A can be shipped within 24 hours after order. If you have any demands for DC0011/07-TI900-0.12-2A, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DC0011/07-TI900-0.12-2A Atributele produsului
Numărul piesei :
DC0011/07-TI900-0.12-2A
Producător :
t-Global Technology
Descriere :
THERM PAD 19.05MMX10.41MM W/ADH
Serie :
Ti900
Starea parțială :
Active
folosire :
TO-220
Tip :
Die-Cut Pad, Sheet
Formă :
Rectangular
Contur :
19.05mm x 10.41mm
Grosime :
0.0050" (0.127mm)
Material :
Silicone
Adeziv :
Adhesive - Both Sides
Înapoi, Carrier :
Viscose
Culoare :
White
Rezistența termică :
-
Conductivitate termică :
1.8 W/m-K
Cele mai recente știri
Poți fi, de asemenea, interesat
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
-
175-6-240P
Wakefield-Vette
THERM PAD 19.1MMX12.7MM GRAY. Thermal Interface Products THERMAL INTERFACE PROD TO-220
Piese calde
- A15996-15
- A15996-13
- A15896-13
- A14950-19
- A14573-01
- A14950-09
- A14561-01
- GP3500ULM--0.020-12-0816
- T69-225-225-0.025-1A
- A15421-15
- DC0040/09-PC99-0.06
- DC0036/04-PC99AL-0.1
- DC0041/04-PC99AL-0.1
- DC0039/06-PC99-0.06
- DC0038/03-PC99AL-0.1
- TG2030S-150-150-3.0-0
- TG2030S-150-150-2.0-0
- TG4040S-320-320-5.0-0
- T68-2A-120-90-0.07
- T68-1B-120-90-0.02
- PC99P-100-100-0.1-0
- A16365-07
- A16365-02
- A16365-03
- A14162-23
- A14162-27
- EYG-A121810A
- 5595 210 MM X 300 MM 2.0 MM
- EYG-A060910B
- EYG-A091210P
- DC0040/09-PC99AL-0.1
- DC0040/01-PC99AL-0.1
- DC0037/01-PCAL-0.1
- SPA2000-0.020-AC-104
- SP400-0.007-00-94
- SPK10-0.006-00-34
- SP1000-0.009-00-90
- SP400-0.009-00-22
- SP400-0.009-00-10
- SP900S-0.009-00-25