69-11-42337-T725 Preț (USD) [17096buc Stoc]
- 1 pcs$2.41063
- Numărul piesei:
- 69-11-42337-T725
- Producător:
- Parker Chomerics
- Descriere detaliata:
- THERMAFLOW 28X28MM 18.
- Timpul de livrare standard al producătorului:
- In stoc
- Termen de valabilitate:
- Un an
- Chip From:
- Hong Kong
- RoHS:
- Modalitate de plată:
-
- Mod de expediere:
- Categorii de familii:
- KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: DC Fanii, Ventilatoare - Accesorii, Chiuvete termice, Termopari, foi, Ventilatoare - Accesorii - Cabluri ventilatoare, Adezivi termici, epoxizi, unsori, paste, Termice - Accesorii and Răcire termică - lichid ...
- Avantaj competitiv:
- We specialize in Parker Chomerics 69-11-42337-T725 electronic components. 69-11-42337-T725 can be shipped within 24 hours after order. If you have any demands for 69-11-42337-T725, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
69-11-42337-T725 Atributele produsului
Numărul piesei :
69-11-42337-T725
Producător :
Parker Chomerics
Descriere :
THERMAFLOW 28X28MM 18
Serie :
THERMFLOW® T725
Starea parțială :
Active
folosire :
-
Tip :
Gap Filler Pad, Sheet
Formă :
Square
Contur :
28.00mm x 28.00mm
Grosime :
0.0050" (0.127mm)
Material :
Non-Silicone
Adeziv :
Tacky - Both Sides
Înapoi, Carrier :
-
Culoare :
Pink
Rezistența termică :
-
Conductivitate termică :
-
Poți fi, de asemenea, interesat
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-22
Wakefield-Vette
THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Piese calde
- A14562-02
- A14558-02
- A14950-20
- GPHC3.0-0.100-02-0816
- A14950-12
- A14950-07
- DC0011/09-PC99-0.06
- 5595S-20
- A16044-01
- DC0040/03-PC99-0.06
- DC0040/06-PC99-0.06
- DC0040/04-PC99-0.06
- DC0038/06-PC99-0.06
- TG4040S-320-320-1.0-0
- TG2030S-150-150-5.0-0
- TG2030S-100-100-3.0-0
- DC0019/03-PC99-0.06
- DC0022/02-PC99-0.06
- DC0025/01-PC99-0.06
- PC93-25-25-0.25
- PC93-5-5-0.25
- PC93-320-320-0.25-0
- GPVOU-0.020-01-0816
- A16365-17
- A16365-15
- A16364-08
- A15641-20
- A10195-06
- A14162-06
- SPK10-0.006-AC-1212
- 5595 210 MM X 300 MM 1.0 MM
- EYG-C121810C
- CPU .005" 12" X 12"
- DC0040/04-PC99AL-0.1
- TP01-M
- 71-10777
- SP400-0.007-AC-136
- PPK10-0.006-00-102
- SP1000-0.009-AC-43
- Q3-0.005-00-34