TG2030-25-25-0.5 Preț (USD) [101653buc Stoc]
- 1 pcs$0.38465
- 10 pcs$0.34567
- 25 pcs$0.32826
- 50 pcs$0.31956
- 100 pcs$0.31529
- 250 pcs$0.29368
- 500 pcs$0.27641
- 1,000 pcs$0.25049
- 5,000 pcs$0.24186
- Numărul piesei:
- TG2030-25-25-0.5
- Producător:
- t-Global Technology
- Descriere detaliata:
- THERM PAD 25MMX25MM WHITE.
- Timpul de livrare standard al producătorului:
- In stoc
- Termen de valabilitate:
- Un an
- Chip From:
- Hong Kong
- RoHS:
- Modalitate de plată:
-
- Mod de expediere:
- Categorii de familii:
- KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: DC Fanii, Termoelectrice, ansambluri Peltier, Termopari, foi, Adezivi termici, epoxizi, unsori, paste, Termice - Accesorii, Chiuvete termice, AC Fanii and Ventilatoare - Accesorii - Cabluri ventilatoare ...
- Avantaj competitiv:
- We specialize in t-Global Technology TG2030-25-25-0.5 electronic components. TG2030-25-25-0.5 can be shipped within 24 hours after order. If you have any demands for TG2030-25-25-0.5, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
TG2030-25-25-0.5 Atributele produsului
Numărul piesei :
TG2030-25-25-0.5
Producător :
t-Global Technology
Descriere :
THERM PAD 25MMX25MM WHITE
Serie :
TG2030
Starea parțială :
Active
folosire :
-
Tip :
Conductive Pad, Sheet
Formă :
Square
Contur :
25.00mm x 25.00mm
Grosime :
0.0197" (0.500mm)
Material :
Silicone Elastomer
Adeziv :
Tacky - Both Sides
Înapoi, Carrier :
-
Culoare :
White
Rezistența termică :
-
Conductivitate termică :
2.0 W/m-K
Cele mai recente știri
Poți fi, de asemenea, interesat
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Piese calde
- A15796-22
- A16006-08
- A15896-31
- A14574-01
- A14570-01
- GPHC3.0-0.080-02-0816
- A14566-01
- A14950-09
- A14950-06
- A14557-01
- T69-225-225-0.025-1A
- 5519S-2MIL
- PC99-107.95-61.98-0.06
- A14162-42
- A14162-24
- DC0036/03-PC99AL-0.1
- DC0036/02-PC99-0.06
- DC0038/07-PC99-0.06
- TG4040S-150-150-3.0-0
- TG4040S-100-100-2.0-0
- TG2030S-100-100-5.0-0
- PC94-100-100-0.25-0
- TGX-2-320-320-1.5
- PC93-10-5-0.25
- PC93-10-10-0.25
- 100MM-1M-5515-20
- A15673-20
- A15673-12
- A16365-19
- A16365-09
- A14162-31
- A10113-81
- SPK10-0.006-AC-1212
- 5591S 210 MM X 300 MM 2.5 MM
- TW12
- EYG-A060910P
- 5519S 210 MM X 155 MM X 0.5 MM
- SPK4-0.006-AC-97
- SP400-0.007-00-25
- Q3-0.005-00-25