A15427-005 Preț (USD) [173187buc Stoc]
- 1 pcs$0.21357
- 10 pcs$0.20408
- 25 pcs$0.19395
- 50 pcs$0.18881
- 100 pcs$0.18624
- 250 pcs$0.17347
- 500 pcs$0.16326
- 1,000 pcs$0.14796
- 5,000 pcs$0.14285
- Numărul piesei:
- A15427-005
- Producător:
- Laird Technologies - Thermal Materials
- Descriere detaliata:
- THERM PAD 19.05MMX12.7MM AMBER.
- Timpul de livrare standard al producătorului:
- In stoc
- Termen de valabilitate:
- Un an
- Chip From:
- Hong Kong
- RoHS:
- Modalitate de plată:
-
- Mod de expediere:
- Categorii de familii:
- KEY Components Co., LTD este un distribuitor de componente electronice care oferă categorii de produse, inclusiv: Chiuvete termice, Termoelectrice, ansambluri Peltier, Ventilatoare - Accesorii - Cabluri ventilatoare, Tevi termice - căldură, camere de vapori, Adezivi termici, epoxizi, unsori, paste, Ventilatoare - gardieri pentru degete, filtre & am, Răcire termică - lichid and Ventilatoare - Accesorii ...
- Avantaj competitiv:
- We specialize in Laird Technologies - Thermal Materials A15427-005 electronic components. A15427-005 can be shipped within 24 hours after order. If you have any demands for A15427-005, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A15427-005 Atributele produsului
Numărul piesei :
A15427-005
Producător :
Laird Technologies - Thermal Materials
Descriere :
THERM PAD 19.05MMX12.7MM AMBER
Serie :
Tgard™ K52
Starea parțială :
Active
folosire :
TO-220
Tip :
Insulator Pad, Sheet
Formă :
Rectangular
Contur :
19.05mm x 12.70mm
Grosime :
0.0030" (0.076mm)
Material :
Polyimide, Ceramic Filled
Adeziv :
-
Înapoi, Carrier :
-
Culoare :
Amber
Rezistența termică :
-
Conductivitate termică :
-
Cele mai recente știri
Poți fi, de asemenea, interesat
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Piese calde
- A15796-23
- A15996-15
- A15896-14
- A15896-13
- A15796-25
- A14950-18
- A15896-06
- A15996-05
- A14950-04
- A14559-01
- DC0041/03-PC99-0.06
- DC0040/08-PC99AL-0.1
- DC0038/03-PC99-0.06
- DC0040/06-PC99AL-0.1
- DC0041/01-PC99AL-0.1
- DC0039/03-PC99-0.06
- TG4040S-100-100-1.0-0
- TG2030S-300-300-3.0-0
- TG2030S-100-100-3.0-0
- TG2030S-300-300-2.0-0
- T68-2A-120-90-0.07
- T68-1A-120-90-0.04
- PC94-300-300-0.25-0
- DC0025/01-PC99-0.06
- DC0022/01-PC99-0.12
- PC93-30-30-0.25
- PC93-20-20-0.25
- PC99P-150-150-0.1-0
- PC99-300-300-0.12-0
- PC99AL-150-150-0.1-0
- 200MM-1M-5515-20
- 25.4MM-5M-5515-20
- A16365-17
- A15798-00
- A16017-19
- TP01
- CPU 1.75X1.75
- DC0039/02-PC99-0.06
- SP1500ST-0.008-00-1012
- EYG-S0202AFAA